applications ? computers and peripherals ? hdtv equipment ? blu-ray/dvd players ? a/v equipment ? satellite and hd radio ? cell phones ? pdas ? digital still cameras ? digital camcorders ? mp3 / multimedia players ? set top boxes ? external storage ? dsl modems ? gps ? high speed data ports - usb 2.0/3.0 - ieee 1394 - high speed ethernet - dvi - infiniband ? - hdmi part numbering system: 0603 esda 2 tr2 package size product family second generation designator packaging code packaging ? 5000 pieces in paper tape on 7 inch diameter (178mm) reel per eia standard 481. packaging code 0603esda2-tr2 esd suppressor polysurg ? series 0612 bu-sb12433 page 1 of 2 data sheet 4419 surface mount device description the second generation polysurg? 0603esda2-tr2 esd suppressors protect valuable high-speed data circuits from esd damage without distorting data signals as a result of its ultra-low (0.15pf maximum) capacitance. features ? lead free, halogen free materials ? 0603/1608 footprint surface mount device ? ideal esd protection for high frequency, low voltage applications ? exceeds testing requirements of iec 61000-4-2 ? ultra low capacitance (0.15pf maximum) ? very low leakage current ? fast response time ? bi-directional specifications performance characteristics units min typ max continuous operating voltage vdc - - 14 30 clamping voltage 1 v- -3560 trigger voltage 2 v - - 350 - - esd threat voltage capability kv - - 8 15 capacitance (@ 1mhz) pf - - 0.10 0.15 leakage current (@ 12vdc) na - - <0.1 100 peak current a - - 30 typ. 45 operating temperature c -55 +25 +105 esd pulse withstand # pulses 20 >500 - - 1. per iec 61000-4-2, 30a @ 8kv, level 4, contact discharge, measurement made 30ns after initiation of pulse. 2. trigger measurement made using transmission line pulse (tlp) method. device marking polysurg? esd suppressors are marked on the tape and reel packages, not individually. since the product is bi-directional and symmetrical, no orientation marking is required. design consideration the location in the circuit for the 0603esda2-tr2 series has to be carefully determined. for better performance, the device should be placed as close to the signal input as possible and ahead of any other component. due to the high current associated with an esd event, it is recommended to use a ?0-stub? pad design (pad directly on the signal/data line and second pad directly on common ground). processing recommendations the 0603esda2-tr2 series currently has a convex profile on the top surface of the part. this profile is a result of the construction of the device. they can be processed using standard pick-and-place equipment. the placement and processing techniques for these devices are similar to those used for chip resistors and chip capacitors. pb halogen hf free package code suffix description -tr2 5000 pieces in paper tape on 7 inch diameter (178mm) reel per eia standard 481
eia size l w h t 0603esda 1.600.15 0.800.10 0.600.10 0.310.21 (0.0630.006) (0.0310.004) (0.0240.004) (0.0120.008) ? 2012 cooper bussmann www.cooperbussmann.com 0612 bu-sb12433 page 2 of 2 data sheet 4419 the only controlled copy of this data sheet is the electronic read-only version located on the cooper bussmann network drive. al l other copies of this document are by definition uncontrolled. this bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with desig n applications. cooper bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. cooper bussmann also reserves t he right to change or update, without notice, any technical information con- tained in this bulletin. once a product has been selected, it should be tested by the user in all possible applications. life support policy: cooper bussmann does not authorize the use of any of its products for use in life support devices or system s without the express written approval of an officer of the company. life sup- port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instr uctions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. t c -5c t max. ramp up rate = 3c/s max. ramp down rate = 6c/s preheat area t smax t smin t s t p t l temperature time 25 time 25c to peak supplier t p > t c - supplier t p t c user t p < t c - user t p t c -5c t p soldering recommendations ? compatible with lead and lead-free solder reflow processes ? peak temperatures and durations: - ir reflow = 260c max for 30 sec. max. capable of 3x reflow. - wave solder = 260c max. for 10 sec. max. - hand soldering = 350c max. for 5 sec. max. recommended ir reflow profile tape and reel specifications - mm (in) w l h t 1.0 max (0.039 max) 1.1 ref (0.043 ref) 0.60 min (0.023 min) (per ipc-sm-782 ) recommended pad layout - in (mm) environmental specifications: ? coating bond strength: astm d3359-83, method a, section 6. note: the device coating is not scored. ? chemical resistance: astm d-543, 4 hrs @ 40c, 3 solutions (h 2 o, detergent solution, defluxer). ? humidity(steady state): mil-std-883, method 1004.7, 85% rh, 85c, 240 hrs. ? thermal shock: mil-std-202f, method 107g, -65c to 125c, 30 min, 5 cycles. ? vibration: mil-std-202f,method 201a,(10 to 55 to 10hz, 1 minute cycle, 2 hrs. each in x-y-z axis). ? solder leach resistance and terminal adhesion per eia-567. ? solderability per mil-std-202, method 208 (95% coverage). ? full load voltage: 14.4vdc, 1000hrs., 25c. ? operating temperature characteristics: electrical testing at +105c and -55c. dimensions - mm (in) profile feature sn-pb eutectic assembly pb-free assembly preheat & soak temperature min (t smin ) 100c 150c temperature max (t smax ) 150c 200c time (t smin to t sma x ) (t s ) 60-120 seconds 60-120 seconds average ramp-up rate (t smax to t p ) 3c/second max. 3c/second max. liquidous temperature (t l ) 183c 217c time at liquidous (t l ) 60-150 seconds 60-150 seconds peak package body temperature (t p )* see classification temp see classification temp in table 4.1 in table 4.2 time (t p )** within 5c of the specified 20** seconds 30** seconds classification temperature (t c ) average ramp-down rate (t p to t smax ) 6c/second max. 6c/second max. time 25c to peak temperature 6 minutes max. 8 minutes max. * tolerance for peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. ** tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum.
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